Populated Waste PCBs
End-of-life printed circuit boards carrying mounted electronic components and soldered connections, including computer boards, control boards, appliance boards and communication boards.
01 / What Problem We Solve
PCB Recycling Solution
Recover copper-rich and non-metallic fractions from waste printed circuit boards through controlled dismantling, crushing, classification and physical separation.
02 / Feedstock
PCB materials this solution is designed to process
This solution can be configured for different PCB and copper-clad laminate feedstocks, with optional front-end dismantling depending on component condition and downstream recovery targets.
PCB Production / Assembly Rejects
Rejected, obsolete or off-spec assembled boards that still contain mounted components and can benefit from controlled dismantling before downstream processing.
Prepared Electronic Boards
Boards already removed from housings, batteries, large heat sinks or other incompatible assemblies and prepared for controlled dismantling or size reduction.
Stripped PCB Substrates
PCB substrates after mounted components have been removed, suitable for crushing, pulverizing and metal / non-metal separation.
Copper-Clad Laminate Scrap
Copper-clad laminate production scrap or prepared laminate material containing bonded copper foil, resin and reinforcing fiber.
03 / Target Recovered Materials
Output fractions this solution is designed to recover
The final output fractions depend on PCB construction, component-removal strategy, liberation quality and downstream requirements. The process is configured around the material fractions the project intends to recover.
Copper-Rich Metal Fraction
Metal-rich fraction containing liberated copper and other conductive material recovered after physical separation.
Resin-Rich Fraction
Non-metallic fraction containing resin-rich PCB material separated from conductive particles.
Fiber-Rich Fraction
Glass-fiber-rich non-metallic material separated from liberated PCB fractions.
Dismantled Electronic Components
Components removed from populated boards before crushing where front-end dismantling is included in the selected process route.
Recovered Solder / Fine Metal-Bearing Residue
Solder and fine metal-bearing material that may be collected separately depending on feedstock, dismantling method and equipment configuration.
04 / Recommended Recycling Process
Recommended process logic for PCB recycling
This is recommended process logic, not a fixed production line. Component removal, crushing stages and separation methods are adjusted according to feedstock condition and recovery objectives.
-
01
Feedstock Characterization
Confirm PCB type, component condition, laminate structure, contamination, board size and target recovered fractions before selecting the final process route.
-
02
Optional Component Dismantling
Remove mounted components or soldered assemblies where front-end dismantling improves downstream processing or enables separate component recovery.
-
03
Primary Crushing
Reduce prepared PCBs or stripped substrates to a controlled size suitable for secondary liberation.
-
04
Fine Crushing / Pulverizing
Further liberate copper-bearing particles from resin and fiber so physical separation stages can work more effectively.
-
05
Screening & Physical Separation
Classify the material by particle size and use gravity, airflow or other suitable dry separation methods to separate different fractions.
-
06
Electrostatic Separation & Final Collection
Improve metal / non-metal separation where appropriate and collect the resulting copper-rich, resin/fiber-rich and fine fractions separately.
Stages can be added, skipped or reordered after feedstock characterization and project review.
05 / Safety & Environmental Control
Safety and environmental control
Dust and fine non-metallic control
Coordinate enclosed conveying, negative-pressure handling and dust collection around pulverizing and classification stages.
05 / Recommended Production Lines
Complete process systems that support this solution
Recommended production lines provide complete processing configurations that can be adapted to PCB type, component condition, required capacity and target recovered fractions.
Request a Technical Proposal
Share PCB type, component condition, capacity, desired recovered fractions and site constraints so BREM can prepare a technical proposal.